This is an all-in-one automated programming system that completes everything from IC programming to laser marking and visual inspection.
PAL-2V is a 16 socket x 2 total 32 socket fully automated programming system equipped with two super high speed Gang Programmer "MODEL516".
In addition, it is a model that allows visual inspection of IC devices and laser marking after programming.
Equipped with two high-performance gang programmers "MODEL 516". Supports from small capacity flash memory to large capacity memory such as eMMC and NAND.
When using the eMMC dual socket adapter, 32 sockets x 2 sites, 64 sockets in total, can be programmed simultaneously.
In the state that adsorbed a IC device after programed, it can give a high-precision test at high speed. Target packages: SOP, QFP, BGA, SON
Available for holding 21 JEDEC trays . Available for continuous running of 21 trays maximally.
It is equipped with an image inspection camera that correct the position of the image and then perform laser marking with a hybrid laser and checks whether marking is OK after that.
Tray data, socket adapter data, project data, marking data, and vision data can be managed collectively with task data. The software supports Japanese and English languages, and also supports barcode system.
|Device programmer||MODEL516 (16 socket) x 2 units|
|Programmer buffer memory||Standard 1024Gbit|
|Target IC device||eMMC, eSD, GB-NAND, MoviNAND, i-NAND, NAND, OneNAND, Flash built-in MCU, NOR, etc.|
|Operation Log||Automatically save each lot in text format|
|Target IC package||TSOP・SOP・BGA・QFP|
|Target socket adapter||Open-top (OT socket adapter)|
|IC device handling||
X, Y, Z, θ 4-axis 2-phase pulse motor + belt drive
X-axis minimum resolution: 1.0 μm / pulse
Y-axis minimum resolution: 1.0 μm / pulse
Z axis minimum resolution: 1.0 μm / pulse
θ-axis minimum resolution: 0.02°/pulse
|IC device transport capacity||
800 [UPH] UPH = Units per hour
*Excluding work sequences such as tray transfer
|Coordinate data registration method||
X-Y, Theta coordinates: Visual setting with dedicated pad and dedicated jig
Fully automatic positioning method
Original system by image processing
|3D IC device visual inspection||Inspectable IC package: SOP, QFP, BGA, SON
Inspection details: Coplanarity, IC lead position and lead pitch
Target pitch: 0.4 mm or more, target IC ball: diameter 0.2 mm or more, inspection range: 25 mm or less
Tray loader method (standard) / Target tray: JEDEC (Size: 315.8mmx135.8mm for automatic transportation * Vacuum pick site is necessary in the center) / EIAJ
Number of storage tray 21 supplies, 21 storage
|Laser marker (hybrid type)||IC marking range: 28 mm or less, character size: 1.0 mm or more, depth: 10-20 μm (with margin).|
|User interface||LCD panel (touch panel function is installed as standard), keyboard, mouse|
|Air supply||0.45Mpa-0.55Mpa 50l/min *Limited to dry air|
ACIN: 3-phase 200V 60Hz 30A
Can be changed according to the installation location.
(D) 1510 x (W) 1900 x (H) x 1650 (mm) Approximately 1400 kg
* Does not include protrusions, PC and monitors.