PRODUCT & SERVICE Device Programmer


This is an all-in-one automated programming system
that completes everything from IC programming to laser marking and visual inspection.

PAL-2V is a 16 socket x 2 total 32 socket fully automated programming system equipped with two super high speed Gang Programmer "MODEL516".
In addition, it is a model that allows visual inspection of IC devices and laser marking after programming.



Equipped with two high-performance gang programmers "MODEL 516". Supports from small capacity flash memory to large capacity memory such as eMMC and NAND.

eMMC Dual Socket Adapter

When using the eMMC dual socket adapter, 32 sockets x 2 sites, 64 sockets in total, can be programmed simultaneously.

3D Visual Inspection System

In the state that adsorbed a IC device after programed, it can give a high-precision test at high speed.
Target packages: SOP, QFP, BGA, SON

Tray arrangement

Available for holding 21 JEDEC trays . Available for continuous running of 21 trays maximally.

Laser Marker

It is equipped with an image inspection camera that correct the position of the image and then perform laser marking with a hybrid laser and checks whether marking is OK after that.

Operation Screen

Tray data, socket adapter data, project data, marking data, and vision data can be managed collectively with task data. The software supports Japanese and English languages, and also supports barcode system.


Device programmer

Device programmer MODEL516 (16 socket) x 2 units
Interface USB3.0
Programmer buffer memory Standard 1024Gbit
Target IC device
eMMC, eSD, GB-NAND, MoviNAND, i-NAND, NAND, OneNAND, Flash built-in MCU, NOR, etc.
Operation Log Automatically save each lot in text format


Target IC package TSOP・SOP・BGA・QFP
Target socket adapter Open-top (OT socket adapter)
IC device handling
X, Y, Z, θ 4-axis 2-phase pulse motor + belt drive
X-axis minimum resolution: 1.0 μm / pulse
Y-axis minimum resolution: 1.0 μm / pulse
Z axis minimum resolution: 1.0 μm / pulse
θ-axis minimum resolution: 0.02°/pulse
IC device transport capacity 800 [UPH] UPH = Units per hour
*Excluding work sequences such as tray transfer
Coordinate data registration method
Manual method
X-Y, Theta coordinates: Visual setting with dedicated pad and dedicated jig
Z coordinate: Auto teaching

Fully automatic positioning method
Original system by image processing
3D IC device visual inspection
Inspectable IC package: SOP, QFP, BGA, SON
Inspection details: Coplanarity, IC lead position and lead pitch
Target pitch: 0.4 mm or more, target IC ball: diameter 0.2 mm or more, inspection range: 25 mm or less
Supply method
Tray loader method (standard) / Target tray: JEDEC (Size: 315.8mmx135.8mm for automatic transportation * Vacuum pick site is necessary in the center) / EIAJ
Number of storage tray 21 supplies, 21 storage
Laser marker
(hybrid type)
IC marking range: 28 mm or less, character size: 1.0 mm or more, depth: 10-20 μm (with margin).
Control Windows10
User interface
LCD panel (touch panel function is installed as standard), keyboard, mouse
Network compatible Ethernet
Air supply
0.45Mpa-0.55Mpa 50l/min *Limited to dry air
Power supply ACIN: 3-phase 200V 60Hz 30A
Can be changed according to the installation location.
Machine size/weight
(D) 1510 x (W) 1900 x (H) x 1650 (mm) Approximately 1400 kg
* Does not include protrusions, PC and monitors.

Device Programmer